Ucamco's LeVina: Direct Imaging for Next-gen Packaging Substrates
November 14, 2023 | UcamcoEstimated reading time: 1 minute
Ucamco is proud to introduce LeVina to the European market. LeVina is the perfect Direct Imaging solution for next-gen packaging substrates.
Just like Ledia direct imagers, LeVina is Japanese technology made by SCREEN.
World-leading imaging of 2 µm
LeVina combines superior imaging heads equipped with SCREEN’s proprietary GLVTM optical engine and laser control technologies that utilize an optical system featuring more of SCREEN’s unique expertise. This new system is specifically designed for mass production and enables direct imaging of substrates at a market-leading resolution of 2/2 μm L/S. It will continue to deliver high-definition patterning of advanced packages even as they become increasingly miniaturized.
Throughput of 100 substrates per hour with L/S = 5/5 µm
LeVina is fitted with an extremely reliable multi-head system and stage capable of moving at up to 480 millimeters per second. Alignment marks are read during scanning, allowing outstanding throughput regardless of the number of marks in the scanning direction (can also be automated). These features enable high resolution processing up to 100 substrates (510 x 515 mm) per hour at L/S = 5/5 μm.
Low running costs
Thanks to the laser diodes used in its light source, LeVina cuts operating costs by around 70%.
Improved cleanness
With LeVina, sources of particle generation have been blocked and it has been equipped with airflow control technologies that have a proven record in cleaning equipment for the semiconductor market. These advances have reduced contamination inside the system, helping to significantly improve yields.
Learn more at Productronica
Ucamco will feature a testing panel of LeVina at Productronica in Munich next week, November 14-17. Visit us in hall B3, booth 425 to learn more about this ground-breaking technology.
Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
Amphenol Reports Q1 2024 Results, Announces New Stock Repurchase Program
04/26/2024 | BUSINESS WIREAmphenol Corporation reported first quarter 2024 results. In addition, the Company is announcing a new three-year, $2 billion stock repurchase program.
KLA Corporation Reports Fiscal 2024 Third Quarter Results
04/26/2024 | KLAKLA Corporation announced financial and operating results for its third quarter of fiscal year 2024, which ended on March 31, 2024, and reported GAAP net income of $601.5 million and GAAP earnings per diluted share of $4.43 on revenue of $2.36 billion.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.