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Suggested Items

Future Innovators Challenged by UK Robotics Leaders to Design Nuclear Fission and Fusion Decommissioning Robots

05/09/2024 | RAICo
Students in West Cumbria have been tasked by the Robotics and AI Collaboration (RAICo) and the Industrial Solutions Hub (iSH) to design and build robots which will be showcased at a major robotics and artificial intelligence (RAI) industry event.

Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.

Real Time with… IPC APEX EXPO 2024: Circuit Board Testing Strategies and the Impact of AI

05/08/2024 |
Editor Marcy LaRont speaks with Bert Horner, president of The Test Connection, about the importance of strategic planning and design-for-test (DFT). Bert touches on some common mistakes that occur when DFT is not adequately considered early on. The discussion outlines an overarching industry need for a culture shift toward increasingly higher levels of integration and collaboration. Bert mentions that AI now has an influence on testing, as everywhere else, and announces his forthcoming book.

Micross, Sital Announce Global Manufacturing & Distribution Partnership

05/07/2024 | Micross Components, Inc.
Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.

Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing

04/24/2024 | Real Time with...IPC APEX EXPO
Editor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.
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