Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Introducing the Modernized Dymax UVCS V3.0 LED Conveyor for High-Speed Operations

06/07/2024 | Dymax
Dymax, a leading manufacturer of rapid curing materials and equipment, introduces the UVCS V3.0 LED Conveyor, an enhanced version of the renowned and reliable Dymax UVCS conveyor curing systems.

The Pulse: Overconstraining: Short, Slim, and Smooth

06/06/2024 | Martyn Gaudion -- Column: The Pulse
Engineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.

Overconstrain? Underconstrain? Selecting Materials for High-speed Designs

06/06/2024 | Andy Shaughnessy, Design007 Magazine
When selecting materials for a high-speed design, you need to be very familiar with the materials’ electrical characteristics, as well as the requirements of the PCB you’re designing. There are myriad details that need to be considered during the material selection process, and missing one iota can lead to your job being put on hold. We asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.

Underconstraining Your Materials? Leave It to the Experts

05/30/2024 | I-Connect007 Editorial Team
With traditional laminates now sporting improved resin systems, some OEMs are choosing various flavors of FR-4 instead of high-speed laminates for their high-speed designs—even RF applications. Avoiding overconstraining your materials in high-speed products can lead to considerable cost savings, not to mention a more streamlined trip through fabrication.

Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program

05/30/2024 | Bell
Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in