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Table of Contents for the Digital Edition of PCB-Sept2011
Cover
Introduction
Contents
Column — Unintended Consequences
Feature — The Electro/Optical Opportunity
Column — Embedded Signal Routing
Video Interview — A Novel Approach Using Flex for Interconnect
Short — Total Ecosolutions Award for Eden—Electrodialysis System for Electroless Nickel
News — Flex007 Highlights
Feature — An Update on Developing Technologies of Integrated Optical Waveguides in Printed Circuits
Column — Conductive Pastes and Inks
Video Interview — Endicott Interconnect Still On the Leading Edge
Short — IPC Unveils Supplier Declaration Subcommittee Leaders
Feature — Success is in the Tiny Details: A Case Study on Solving Reliability Issues in a Micro-Optic Module
Column — How to Implement Lean Manufacturing into a PCB Shop, Part 5: Lean Training (Continued)
News — MilAero007 Highlights
Feature Short — Solving Longstanding Problems in Photonic Chip Technology: Paving the Way for Next Generation of Computer Chips
Feature — The Photon Era
News — PCB Design007 Highlights
Column — Plating Anomalies and Defects, Part 1
Short — Conference Highlights European PCB Industry
Feature — Overcome Copper Limits with Optical Interfaces
PCB-Sept2011
10
OPTICAL INTERCONNECT
SEPTEMBER 2011
SUMMARY
INNOVATIVE ENGINEERING DESIGN INCORPORATED INTO EVERY PRESS SYSTEM
UNINTENDED CONSEQUENCES continues
UNINTENDED CONSEQUENCES continues
THE ELECTRO/OPTICAL OPPORTUNITY
THE ELECTRO/OPTICAL OPPORTUNITY continues
SUMMARY
EMBEDDED SIGNAL ROUTING continues
EMBEDDED SIGNAL ROUTING continues
EMBEDDED SIGNAL ROUTING continues
A Novel Approach Using Flex for Interconnect
FLEX007 Highlights
Your Single Source
An Update on Developing
Global leaders in testing.
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
DEVELOPING TECHNOLOGIES ON INTEGRATED OPTICAL WAVEGUIDES IN CIRCUITS continues
SUMMARY
CONDUCTIVE PASTES AND INKS continues
Endicott Interconnect Still On the Leading Edge
Success is in the Tiny Details:
We were able to analyze the product, work out the failures and devise a way to
SUCCESS IS IN THE TINY DETAILS continues
SUCCESS IS IN THE TINY DETAILS continues
Why choose Fein-Line?
SUMMARY
LEAN MANUFACTURING, PART 5: LEAN TRAINING continues
LEAN MANUFACTURING, PART 5: LEAN TRAINING continues
MILAERO007 Highlights
IPC EXECUTIVE SUMMIT: Management Meetings and Market & Technology Conference
Solving Longstanding Problems
something scientists have been pursuing for 20
PHOTON
“
THE PHOTON ERA continues
Flexible Circuit Technology
THE PHOTON ERA continues
PCBDESIGN007 Highlights
SUMMARY
PLATING ANOMALIES AND DEFECTS, PART 1 continues
PLATING ANOMALIES AND DEFECTS, PART 1 continues
OVERCOME COPPER LIMITS
“
OVERCOME COPPER LIMITS WITH OPTICAL INTERFACES continues
OVERCOME COPPER LIMITS WITH OPTICAL INTERFACES continues
OVERCOME COPPER LIMITS WITH OPTICAL INTERFACES continues
OVERCOME COPPER LIMITS WITH OPTICAL INTERFACES continues
The Year of Design
Thermal Transfer
“
ULTRA EFFICIENT THERMAL TRANSFER continues
SUPPLIER/NEW PRODUCT Highlights
Revolutionary Solution for the PCB Industry:
“
DIGITAL INKJET SOLDER MASK PRINTING continues
DIGITAL INKJET SOLDER MASK PRINTING continues
DIGITAL INKJET SOLDER MASK PRINTING continues
SUMMARY
MESSAGE TO GOVERNMENT: LEARN FROM BUSINESS continues
TOP
e EnFACE: A Maskless
SUMMARY
it’s only struggling because of the bad
EVENTS
PUBLISHER: BARRY MATTIES