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Building on a record of past successes, SEMI today announced the fifth SEMI European 3D Summit. The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme “European 3D Summit 2017 – Creating High Density Systems.”
The 2017 SEMI European 3D Summit will continue to explore a wider scope of 3D topics that include 3DIC Through-Silicon-Via (TSV) technology and associated challenges. In addition, the Summit will include discussions on 2.5D, 3D FO-WLP/ e-WLB, glass interposers, and 3D alternative technologies for Heterogeneous Integration and High Density Systems. Leading thought leader keynote and technical speakers will present their approaches and strategies for 3D Integration technologies, with particular attention on current adoption for applications such as: high-end memories, performance applications, mobile, imaging, and automotive.
In the past few years, the increasing use of 3D technology in microelectronics devices has reshaped the electronics market. As in previous SEMI European 3D Summits, SEMI will highlight the latest business challenges and opportunities in the 3D sector with a market briefing, where attendees will hear from 3D and packaging industry experts discuss business and market insights and reverse engineering analysis.
Up to 30 companies working in 3DIC and advanced packaging will have the opportunity to exhibit their technologies and solutions at SEMI European 3D Summit exhibition. Located adjacent to the conference auditorium, the exhibition will be a high-traffic hall giving exhibitors many opportunities to interact with potential customers and manufacturers. In addition to high-caliber speakers and exhibitors, The SEMI European 3D Summit will provide attendees with numerous networking opportunities throughout the event, including networking lunches, coffee breaks, a gala dinner, and a complimentary one-on-one business meeting service.
SEMI will also arrange for attendees a chance to visit the Minatec Showroom, near the conference amphitheater, for a taste of the latest innovations currently in development within the Grenoble tech hub.
The European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, Globalfoundries, imec, Scint-X, SPTS, STMicroelectronics and SUSS Microtec.
The SEMI European 3D Summit consistently has a high industry turnout with stellar satisfaction rates (96% overall satisfaction rate, 2012-2016).
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.