-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Mentor Graphics Launches Xpedition Multi-Board Systems Design Solution
October 24, 2016 | PRNewswireEstimated reading time: 2 minutes
Mentor Graphics Corporation has announced its new Xpedition multi-board systems design solution which enables seamless concurrent multi-discipline team collaboration to efficiently manage increasing system complexity. The Xpedition flow maximizes team efficiency by eliminating redundant effort during the design process, and optimizes product performance and reliability with a data management infrastructure. This ensures data integrity and leverages reusable IP across all boards, connectors, and cables in the system.
Designing systems that contain multiple interconnected boards (connectors and/or cables) has traditionally been done with separate uncoupled board and cabling projects held together by desktop office tools such as spreadsheets for intra-board connectivity, text files for system element parameters and drawing applications to show block level system structure and hierarchy. The result is poor collaboration between cross-domain design teams; costly intra-system connectivity errors; extensive time-consuming manual validation steps; and restrictive system change rules that prohibit system design optimization. This lack of holistic multi-board system design further impacts the ability to design networks of interconnect electronic systems, commonly known as system-of-systems that are commonly seen in automotive, space/satellites, industrial automation and data center infrastructure.
When designing a leading-edge, high-performance lithography system, with dozens of multidisciplinary teams working in parallel, we face the challenge of ensuring the consistency and correctness of the entire design to meet our challenging time-to-market goals," said Jan van Vlerken, ASML Senior Director of Electronics Development. "Using Mentor's Xpedition multi-board systems design solution we can design connectivity from the conceptual level down to PCB layout in a single design flow in shorter time, with fewer re-spins, and improved consistency of drawings.
The new Xpedition multi-board systems design flow improves design team productivity and reduces development cost by replacing inefficient paper and manual processes with an automated, fully integrated, collaborative workflow. The automated synchronization between all levels of abstraction and automated connector management will help design teams achieve time-to-market targets. Signal tracing, functional and signal integrity simulation, and design partitioning and re-partitioning while maintaining connectivity content ensures "correct by construction" system design. The new Xpedition flow is a fully parallel collaborative design environment where global teams can work in "real-time," providing companies with the flexibility and intuitive technologies to develop innovative and competitive products.
"The management of electronics connectivity is immensely complex and a key challenge for systems architects today, yet this problem hasn't been adequately addressed previously," stated Laurie Balch, chief analyst, Gary Smith EDA. "Mentor Graphics has a leg-up in the market with its robust solution for multi-board systems development based on its breadth and depth of systems design and analysis technologies."
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.