Alpha to Feature Die Attach, High Temp Dip Tinning Technologies at Internepcon Japan 2017


Reading time ( words)

Alpha Assembly Solutions will feature its range of ALPHA Products for Die Attach, High Temp Dip Tinning technologies and Assembly Polymers at the 2017 Internepcon Japan show, which will be held in Tokyo from January 18–20, 2017. 

The commercialization of new technology has proven to be a complex process. Silver sintering has attracted a lot of interest over the last decade and has shown the ability to fulfill the electronics device reliability requirements.

"Alpha Argomax silver sintering products are the only products on the market that can be used in different form factors like paste, films or even preforms. These technologies have been developed by Alpha, a part of the MacDermid Performance Solutions group of businesses, to allow a fast (350°C. The alloys have been engineered to retain a highly reflective solder surface with very minimal surface oxide layer formation after long hours of high heat exposure, as compared to the generic alloys such as SnCu0.7 and SnCu3 alloys. The superior wetting performance of this alloy along with reduced pot maintenance due to low dross rates help improve production yield," said Bernice Chung, Regional Product Manager for Alloys.

Alpha Assembly Polymers include products ranging from Alpha Staychip underfills, Alpha Staychip epoxy flux, Alpha Staychip low-temperature adhesives and other Alpha Staychip epoxy related materials.

"These products are for applications requiring reinforcement of assembled parts/components, low temperature bonding, UV bonding or Dual Curing bonding. Selecting optimally the right Assembly Polymer for your application is critical," said Jimmy Shu, Director of Marketing for the Asia Pacific Region.

To learn more about new Alpha products, please visit Alpha at Internepcon Japan - Hall East 8-22.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. 

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox® and Fortibond™ brands. 

For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.  

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here

Share


Suggested Items

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

12/28/2017 | Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.



Copyright © 2018 I-Connect007. All rights reserved.