Digital Light Engine technology to illuminate F-22 Head-Up Display
January 17, 2017 | BAE SystemsEstimated reading time: 1 minute
BAE Systems has been selected by Lockheed Martin to modernize the F-22 Raptor’s head-up display (HUD) for the U.S. Air Force, replacing it with a completely digital version.
Under terms of the contract, BAE Systems will use its advanced Digital Light Engine (DLE) technology to implement a form, fit, and function HUD solution that integrates seamlessly into the F-22’s existing HUD space. The company then anticipates receiving a follow-on production contract to retrofit the F-22 fleet’s current HUDs with the modern DLE solution.
“The F-22 is a premier fighter aircraft of the U.S. Air Force, and its pilots deserve the most advanced situational awareness technology available today,” said Andy Humphries, director of Advanced Displays at BAE Systems. “We’ve worked closely with Lockheed Martin to deliver a completely modernized HUD solution for the F-22 fleet that meets the long-term needs of the Air Force.”
The DLE package is compatible with any existing aircraft interface. Designed for mission effectiveness, the upgrade removes the conventional cathode ray tube image source and introduces a more advanced digital display solution. The digital technology offers increased reliability, eliminates high-maintenance and obsolete items, and provides a constant luminance performance.
“This new F-22 head-up display is a great example of how the F-22 industry team is integrating innovative technologies into the combat Raptor fleet,” said Ken Merchant, vice president of the F-22 program at Lockheed Martin. “This directly supports our ongoing efforts to deliver affordable and reliable new capabilities to our Air Force customer and warfighters.”
BAE Systems has been a leader in HUD development and production for more than 50 years, a position gained through continuous investment in technology and innovation. The company has produced more than 15,000 head-up displays that have been in service on more than 50 different aircraft types in more than 50 countries around the world. BAE Systems’ displays perform on some of the most advanced and demanding military aircraft around the world.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.