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Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
Real Time with...IPC APEX EXPO
Avi Greenberg of Orbotech, a KLA company, discusses how their solutions can help the ICS market and the many manufacturing challenges which impact quality and capacity. The conversation also covers an additive printing solution.
Pete Starkey, I-Connect007
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”
I-Connect007 Editorial Team
Meet Sharon Cohen, one of our newest I-Connect007 columnists! Sharon’s columns will share Orbotech’s expert knowledge on how to maximize the value of manufacturing systems. Mr. Sharon Cohen is the president of Orbotech West, where he is responsible for the PCB division’s organization in North America and EMEA (Europe, Middle East, and Africa).