-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
GPC Electronics Enhances Inspection Capabilities
March 30, 2017 | GPC ElectronicsEstimated reading time: 1 minute
Modern communications products are becoming more challenging to manufacture with high density of placements and miniature devices. As a result, traditional human eye inspection methods are no longer effective. For example, 0201 is now common and 01005 and 008004 (0.25mm x 0.125mm) are coming through. These types of components cannot be effectively inspected by the human-eye, even with the aid of modern camera based inspection systems.
Older AOI systems were unreliable and ineffective due to the high level of operator intervention required due to “false failures” and the need to fine tune the equipment on-line. The ability to use flying probe and in-circuit test (ICT) becomes costly and impractical due to high component density that then results in a lack of test access.
When a number of OEMs in the field of high speed networking and communications products partnered with GPC Electronics, the challenge was verifying PCBA products with typically more than 5,000 placements, component footprints of 0201 or less and with limited or no test access.
The answer was to invest in the most modern AOI equipment available. With installations in GPC Electronics’ Australian, New Zealand and Chinese factories, the advanced AOI provides faster and more reliable inspection. The GPC Electronics advanced AOI can detect a comprehensive range of defects and errors. The key feature is the 4 MPX color camera with an optical resolution of 10µm–15µm. The advanced AOI uses dynamic imaging and its inspection functions include detecting missing components, tomb-stoning, bill-boarding, polarity resolution, wrong marking (OCV) and upside down or defective components. It can also detect excess solder, insufficient solder, bridging, through-hole pins as well as scratches and contamination. All this can be achieved in seconds even for the highest density PCBA’s, whereas more traditional test methods such as flying probe may take 10 minutes or more and still not provide adequate test coverage.
In addition to the ability to remove human eye inspection and achieve faster cycle times, the advanced AOI system provides GPC Electronics rapid process feedback. Moreover, due to the pre-determined programmed parameters, faults can be identified with consistency well before any final or functional test. This early stage verification provides higher product yields and the ability to rationalize down-stream test processes.
Reliability and consistency are the key to driving efficiency and low cost. The introduction of advanced AOI equipment has provided a valuable addition to GPC Electronics' capabilities.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.
Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
03/13/2024 | PVANihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.