-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Neways Pioneers in Miniaturization
April 14, 2017 | Neways Electronics International N.V.Estimated reading time: 2 minutes
Neways Electronics International N.V. has taken an important step in the development of high-density ceramic substrates. This new development enables Neways to use existing conventional screen printing techniques to apply structures of less than 50μm line/gap spacing to ceramic substrates, which is a breakthrough in the miniaturization of integrated electronics.
The development, initiated by Neways Group company Neways Micro Electronics, makes possible electronic connections between fine pitch integrated circuits (or advanced IC packages) on minimal surfaces. The use of lithographic techniques also makes this a cost-efficient process.
This development is in line with the continuing miniaturization of integrated electronics. Components are becoming ever smaller, while at the same time being equipped with greater functionality and have to be placed closer to the source, for instance on a motor or in a valve. This innovation has numerous potential applications in a range of different sectors, for instance, in virtually invisible hearing aids, opto-electronic data-transmitters, medical implants or car sensors.
Daniel Mitcan, manager engineering at Neways Micro Electronics, said, “It is a generally accepted rule that the number of transistors on a chip doubles every two years (Moore’s Law). However, it was a long time before the ceramic carrier became correspondingly smaller. What makes this project special is that we abandoned conventional methods – which have been in general use for 20 years – and that allowed us to take a fresh look at advanced lithographic techniques. A combination of these techniques creates unique hybrid circuits with extremely fine structures that can be produced at conventional, low costs. This will enable us to meet the growing demand for ever smaller and more integrated electronics in the period ahead.”
The findings will be presented at the 13th Ceramic Interconnect and Ceramic Microsystems Technologies conference, which will be held in Nara, Japan, from April 19–21, 2017.
About Neways
Neways Electronics International N.V. (Neways) is an international company active in the EMS (Electronic Manufacturing Services) market. Neways offers its clients custom-made solutions for the complete product life cycle (from product development to after-sales service) of both electronic components and complete (box-built) electronic control systems. Neways operates in a niche of the EMS market and focuses primarily on small to medium-sized specialist series, in which quality, flexibility and time-to-market play a crucial role. Neways products are used in sectors such as the semi-conductor, medical, automotive, telecom and defence industries. Neways has operating companies in the Netherlands, Germany, the Czech Republic, Slovakia and China, with a total of 2,612 employees at year-end 2016. Neways recorded net turnover of € 393 million in 2016. Neways shares are listed on the Euronext Amsterdam stock exchange (symbol: NEWAY). For more information, click here.
Suggested Items
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ark Electronics Expands Global Manufacturing Factory Network in North America and Europe
04/17/2024 | PRNewswireElectronic Manufacturing Company Ark Electronics recently announced the expansion of its Global Factory Network with the addition of Electronics Manufacturing Service (EMS) capabilities in Mexico and Europe.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.