Mirtec Europe to Exhibit at SMT Hybrid Packaging 2017


Reading time ( words)

Mirtec will display its award-winning 3D AOI and SPI inspection systems in pb tec's booth, in Hall 4A, Stand 140 at the upcoming SMT Hybrid Packaging 2017 show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

Mirtec is a strong presence at the show each year, and 2017 is no exception. Mirtec is planning to display several systems, including the MV-6E OMNI, MV-7OMNI, MS-11, and the Intelli-Sys Inc. Intelli-Track.

Mirtec's MV-6E OMNI is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. This all-new MV-6E OMNI 3D inline AOI system is configured with Mirtec's exclusive OMNI-VISION 3D inspection technology which combines our award winning 15-megapixel ISIS Vision System with Mirtec's revolutionary Digital Multi-Frequency Eight Projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies.

Mirtec's 15-megapixel ISIS Vision System is a proprietary camera system designed and manufactured by Mirtec for use with our complete product range of inspection equipment. Mirtec's Digital Multi-Frequency Eight Projection Technology provides true 3D inspection using a total of four programmable digital moiré projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new Mirtec MV-6e OMNI machines feature four 10-megapixel side-view cameras in addition to the 15-megapixel top-down camera.

Mirtec's MV-7 OMNI-QHD 3D AOI machine features the next generation of Mirtec's award-winning OMNI-VISION 3D inspection technology in a high-performance AC servo drive platform. This revolutionary technology combines our proprietary 15MP CoaXPress Vision System with Mirtec's exclusive Quantum High Definition (2048x1536) Digital Multi-Frequency 3D projection technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will, undoubtedly, set the standard by which all other 3D inspection equipment will be measured. The MV-7 OMNI-QHD machine also features four 10-megapixel side-view cameras for inspection of regions of interest which are not accessible with the 15-megapixel top-down camera. 

The MS-11 3D In-Line SPI Machine is configured with Mirtec's exclusive 15MP ISIS Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 uses the same robust platform as Mirtec's MV-7 OMNI Series.

Mirtec's total quality management system software, INTELLISYS also will be on display at the SMT Nuremberg show. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.

Mirtec Europe prides itself on its business philosophy of providing customers with the highest quality products and services at competitive pricing, and recognizes that customers are the source of future growth and, as such, strives for a strong, reliable and long-term partnerships based on trust and respect.

To learn more about Mirtec, stop by Hall 4A, Stand 140 at the show.

About Mirtec

Mirtec is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For further information, click here.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.