-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Flex Officially Opens New Design Center in Israel
April 18, 2017 | FlexEstimated reading time: 1 minute
EMS firm Flex Ltd has officially opened its new design center in Haifa, Israel. The Haifa Design Center was founded at the end of 2012 as part of Flex’s medical research and design initiatives. Due to the increase in projects and the number of hires, in December of 2016, the center was moved to a new 1,000m2 facility located in the southern part of Haifa. It is close to several large international companies such as: Google, Microsoft, Amdocs, Qualcomm, GE, Phillips, Intel, Elbit, Novocure. Currently, the center holds 40 expert design engineers on-site.
The new facility accommodates several labs to support ongoing projects and is equipped for electronic integration and testing, firmware inspection, mechanical assembly and 3D printing. It also has a mechanical workshop, a special lab for optical inspection and assembly, and a lab to support water purification systems.
During the opening of the new facility, Ziva Eger, Chief of Foreign Investment and Industrial Cooperation Authority in Israel, commented, "Flex is one of the key partners for the State of Israel in helping to build the Israeli economy."
Today, the Haifa design center is focused on projects from the medical, industrial, consumer and defense categories and is also the home for two additional Flex groups—the medical technology center and the Flexible Technologies and Miniaturization CoE.
Suggested Items
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/12/2024 | Nolan Johnson, I-Connect007As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.
Material Insight: The Importance of Standards for the Chip Packaging Industry
04/12/2024 | Dr. Preeya Kuray -- Column: Material InsightI had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.
What’s New in Design Education at IPC APEX EXPO?
04/11/2024 | Kelly Allen, IPC Training ManagerKelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.