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During the recent IPC APEX EXPO 2017 show in San Diego, California, Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process.
Larocca describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process. He discusses how the team at Metcal has developed an innovative solution to address the issue and to take another step in their Industry 4.0 strategy.
To view the whole video, click here.
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.