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During the recent IPC APEX EXPO 2017 show in San Diego, California, Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process.
Larocca describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process. He discusses how the team at Metcal has developed an innovative solution to address the issue and to take another step in their Industry 4.0 strategy.
To view the whole video, click here.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.
Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.