AIM's Derek Wang to Present at SMTA China East Vendor Conference

Reading time ( words)

AIM Solder's Derek Wang, Technical Support Manager, will present at the SMTA China East Vendor Conference on April 26, 2017 at the Shanghai World Expo Exhibition & Convention Center in China.

Wang's presentation, scheduled from 11-11:25 am, will highlight AIM's REL61, a low-cost, high reliability alternative to SAC305 and low-/no-silver alloys. REL61 addresses the most challenging issues with today's common lead-free alloys, specifically voiding, cost, durability and tin whiskers. Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity. Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance. Additionally, it will highlight key characteristics of AIM's newly developed REL22 solder alloy for extremely harsh environments.

Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over 13 years' experience in the SMT industry, Derek supports AIM customers in Eastern China.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here


Suggested Items

Cleaning with Data

03/19/2018 | Barry Matties, I-Connect007
Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

Copyright © 2018 I-Connect007. All rights reserved.