Mycronic Receives a Repeat Multiple Order for the MY600 Jet Printer


Reading time ( words)

Mycronic AB has received the third order for several MY600 Jet Printer systems. This is a repeat order from a customer that runs a high-volume consumer application running 24-hour production. Deliveries will take place during the second half-year of 2017.

Mycronic's business area Assembly Solutions offers advanced production solutions for modern electronics manufacturing. The offering comprises production equipment for non-contact application of solder paste on circuit boards, dispensing and conformal coating systems, assembly equipment for placement of components on circuit boards, automated storage solutions, advanced software for effective process management and sophisticated production systems for camera module assembly and test. The equipment is used globally for a wide range of applications within the electronics industry.

The MY600 was developed to offer a competitive alternative or as a complement to the traditional stencil printer, dispensing solder paste at high speed and high accuracy. The versatile MY600 platform can also be configured for dispensing of a wide range of mounting fluids such as glue. Mycronic’s MY600 offers manufacturers new ways to meet challenges in the production process - also relevant for high-volume customers requiring high-speed high-accuracy dispensing of solder paste or other mounting fluids.

”Our customer has developed a new generation of products for the consumer segment where flexible circuit boards are used. Mycronic’s software driven and non-contact jet printing technology handle these applications very well. Our MY600 solution fulfills the customer’s requirement for both yield and speed,” says Clemens Jargon, VP Global Dispensing at Mycronic.

The price for one system is in the span of SEK 1-2 million, depending on options and customization. The total value of the order is in the range of SEK 20-25 million.                              

About Mycronic AB

Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, Taiwan, United Kingdom and the United States. For more information see our website, click here.   

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.