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RTW NEPCON China: Viscom Talks 3D AOI Developments
April 28, 2017 | Real Time with... NEPCON ChinaEstimated reading time: Less than a minute
Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.
Suggested Items
ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment
04/18/2024 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce the expansion of its US-based support team with the appointment of Jeremy Woodworth as Technical Support Senior Engineer based in the United States, effective March 15, 2024.
Yamaha to Showcase Latest-generation Assembly Equipment and Software Tools at SMTconnect
04/16/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section will team with its distributor ANS Elektronik to showcase innovations for high-speed surface mount assembly at SMTconnect 2024.
Marantz Electronics EZPro Software Solution: Streamlining Production Preparation for Cost-Efficient Manufacturing
04/16/2024 | Mek (Marantz Electronics)Marantz Electronics is proud to announce the launch of EZPro Software, Automatic Optical Inspection (AOI) machine programming that harnesses the power of Artificial Intelligence (AI).
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.
New Features Boost Speed, Accuracy, Ease of Use for YAMAHA AOI System
03/18/2024 | Yamaha Robotics SMT SectionYamaha Robotics has announced Performance-boosting upgrades for the YAMAHA YRi-V 3D AOI system. These upgrades include faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement, among others.