Shengyi Technology Earns UL Listing for FR-4 with RTI of 150°C


Reading time ( words)

For over 50 years, printed circuit applications using FR-4 as a base material were limited to 130°C continuous maximum operating temperature (MOT). This was more a definition limit set by UL and ANSI rather than a lack of thermal performance by the FR-4 products. Recently, UL changed the definition to allow FR-4 to be used at temperatures up to 150°C if the long term thermal aging (LTTA) data passed the electrical and mechanical requirements.  

Shengyi is the first base material supplier world-wide to have an FR-4 product listed with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. The product, S1170G, is a halogen-free epoxy system with a Tg of 180°C and a Td of 390°C designed for lead-free processing. The excellent CAF resistance allows S1170G to be used for high reliability applications including automotive, smartphone, and consumer electronics

The product is listed in Shengyi’s UL File # E109769 as an ANSI Grade FR-15.1. FR-15.1 indicates that it is a halogen-free FR-4 product with RTI of 150°C.

Board designers can feel more comfortable knowing that S1170G can be used at higher   temperatures than for traditional FR-4s. Other current FR-4 products will also be listed as

FR-15 in the Shengyi UL file as customer requirements dictate.

About Shengyi Technology Company Ltd.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates and prepregs. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials. Shengyi maintains a state-of-the-art manufacturing facility in Dongguan where it manufactures FR4, CEM-1, CEM-3 and a variety of Prepregs. In addition, the company maintains laminate and prepreg manufacturing operations in Suzhou, Shaanxi and Changshu. Shengyi’s products are used in single-sided, double-sided and multilayer printed circuit boards and the company’s global customer base spans a broad spectrum of markets including mobile phones, automotive, telecommunication equipment, computers and higher-level electrical products. For more information can be found here

Share

Print


Suggested Items

Multilayer Press Technology Using Magnetism to Produce Lamination Heat

11/11/2019 | Victor Lazaro Gallego, Chemplate Materials
A revolutionary concept in multilayer press technology has been developed that uses electromagnetic energy to heat the existing stainless-steel separator plates with a never-before dreamed-of accuracy and precision. The heating and cooling systems—embedded within a robust hydraulic press inside a vacuum chamber design—are controlled using a temperature feedback loop that guarantees perfect fidelity between the press recipe and the press result.

Additive Electronics Conference Set for October 2019 Debut

10/15/2019 | Kelly Dack
Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.

EIPC Summer Conference 2019, Day 2

09/12/2019 | Alun Morgan, EIPC
In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.



Copyright © 2019 I-Connect007. All rights reserved.