Shengyi Technology Earns UL Listing for FR-4 with RTI of 150°C


Reading time ( words)

For over 50 years, printed circuit applications using FR-4 as a base material were limited to 130°C continuous maximum operating temperature (MOT). This was more a definition limit set by UL and ANSI rather than a lack of thermal performance by the FR-4 products. Recently, UL changed the definition to allow FR-4 to be used at temperatures up to 150°C if the long term thermal aging (LTTA) data passed the electrical and mechanical requirements.  

Shengyi is the first base material supplier world-wide to have an FR-4 product listed with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. The product, S1170G, is a halogen-free epoxy system with a Tg of 180°C and a Td of 390°C designed for lead-free processing. The excellent CAF resistance allows S1170G to be used for high reliability applications including automotive, smartphone, and consumer electronics

The product is listed in Shengyi’s UL File # E109769 as an ANSI Grade FR-15.1. FR-15.1 indicates that it is a halogen-free FR-4 product with RTI of 150°C.

Board designers can feel more comfortable knowing that S1170G can be used at higher   temperatures than for traditional FR-4s. Other current FR-4 products will also be listed as

FR-15 in the Shengyi UL file as customer requirements dictate.

About Shengyi Technology Company Ltd.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates and prepregs. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials. Shengyi maintains a state-of-the-art manufacturing facility in Dongguan where it manufactures FR4, CEM-1, CEM-3 and a variety of Prepregs. In addition, the company maintains laminate and prepreg manufacturing operations in Suzhou, Shaanxi and Changshu. Shengyi’s products are used in single-sided, double-sided and multilayer printed circuit boards and the company’s global customer base spans a broad spectrum of markets including mobile phones, automotive, telecommunication equipment, computers and higher-level electrical products. For more information can be found here

Share

Print


Suggested Items

Upcoming IPC APEX EXPO Offers Sessions on 5G

02/03/2020 | Nolan Johnson, PCB007
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.

Residual/Free TBBPA in FR-4

01/31/2020 | Sergei Levchik, ICL-IP America
Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).

Fresh Thinking on the Logistics of Laminate Distribution

01/28/2020 | Barry Matties, I-Connect007
Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.



Copyright © 2020 I-Connect007. All rights reserved.