Koh Young Technology Launches New Interactive Website


Reading time ( words)

Koh Young Technology Inc.'s new, interactive website at www.kohyoung.com offers smooth scrolling navigation, where it takes only a few seconds to scroll through content. Visitors now have quick and easy access to a whole range of Koh Young’s inspection systems including its 3D SPI (Solder Paste Inspection) and AOI (Automated Optical Inspection) systems, semiconductor inspection systems and MOI (Machining Optical Inspection) systems.

Not only it has a more modern look-and-feel with high-resolution real images, visitors can take full advantage of Koh Young's strong global service support with newly introduced Technical Service and Training web pages under the Help Desk menu; where they can post any inquiries, service requests, or suggestions with a simple click.

"We are extremely excited to launch our newly designed website. It brings what Koh Young has been working on last fifteen years into sharp focus," stated Joong-yong Song, Head of Koh Young's Management Planning team. "What's more, visitors can now share our products with their friends and colleagues via social media. I believe this communicative channel will be fundamental tool for expanding our business scope beyond SMT."

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, visit www.kohyoung.com.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.