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Alpha Assembly Solutions is introducing its newest solder paste innovation for ultra-fine feature printing and reflow applications.
ALPHA OM-347 is an ultra-cleanable, no-clean, lead-free, zero-halogen solder paste material that can print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications.
"ALPHA OM-347 is one of the first solder paste formulas introduced specifically designed as an ultra-cleanable, no-clean material," said Traian Cucu, Global Product Manager for Solder Paste at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. "It has an outstanding reflow process window that delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and shows excellent random solder ball and mid-chip solder ball resistance."
This new soldering material from Alpha demonstrates excellent print volume deposit repeatability, thereby providing value to customers by reducing defects that can derive from print process variability.
For more information on ALPHA OM-347 or any other product or process technology, visit the Alpha website.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.
Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.