Koh Young Technology Delivers 10,000th Inspection System


Reading time ( words)

Koh Young Technology recently announced the delivery of its 10,000th 3D inspection system, a Zenith 3D Automated Optical Inspection (AOI) system, sold to Delphi Electronics Co. Ltd in Suzhou, China. The Zenith system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with true three-dimensional accuracy and with comprehensive IPC 610 comparison.

The milestone was celebrated at the Delphi plant, and was attended by JD Shin, Director of Global Sales and Support at Koh Young Technology, Steven Choi, General Manager of Koh Young China, Joe Lee, Process Engineering Manager and Zhao Jun, Staff Engineer at the Delphi Suzhou plant. Delphi Automotive is a high-technology company that integrates safer, greener and more connected solutions for the automotive and transportation sectors. The company has been operating in China since 1993, with more than 20 sites and supplying products to 17 of the top 20 automakers in China.

KohYoung-Delphi01-10k-10Jul17.jpg

Koh Young Technology has been the fastest-growing 3D inspection system provider with No.1 market share in the world, having closed all 10,000 orders since the company’s founding in 2002. Koh Young recently marked its 15th Foundation Day on May 1. With increased dominance of 3D AOI, Koh Young has consolidated its position as the global leader of SMT inspection equipment.

In marking the order milestone, Dr. Kwangill Koh, CEO of Koh Young Technology said, "We are very pleased to celebrate this occasion with Delphi Electronics Suzhou, our trusted partner since 2003. To our team, delivering 10,000 machines is indeed a remarkable achievement; it has been a challenge, and also a great success, because Koh Young is the first inspection company in the SMT industry to break this sales record. But it doesn’t end here; 10,000 deliveries is only the beginning as we continue to help SMT PCB manufacturers around the world build a better process with Koh Young."

At the ceremony, JD highlighted Koh Young's technological milestones, introducing its latest innovations, followed by the presentation of awards. "This milestone also carries momentum for continuing success," JD added. "We will re-double our efforts to continue to provide the world’s best 3D inspection technology, enabling our customers to implement agile, lean manufacturing systems," JD concluded.

"We have chosen to work with Koh Young because of its superior inspection capability on solder joints which uses exclusive IPC 610 standard," said Joe Lee, Process Engineering Manager, Delphi Electronics Suzhou Co. Ltd. "We would like to congratulate the Koh Young team on their remarkable milestone."

Koh Young Technology has always been a pioneer in inspection and measurement technology, beginning with the world’s first 3D solder paste inspection (SPI) in 2004. Now, the company's KSMART Solution, anticipating Industry 4.0 by integrating advanced artificial intelligence (AI) knowledge, helps customers realize Smart Factory visions with the advantages of reliable full 3D measurement data.

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, visit www.kohyoung.com.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.