SMTA Capital Chapter Expo and Tech Forum to be Held on August 24


Reading time ( words)

The SMTA Capital Chapter is inviting the industry to its upcoming Capital Expo and Tech Forum, which will be held at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, on August 24.

During this year's expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corp. Specific topics include "The 'Deadly Sins' of SMT Assembly," "Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly," and, "Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics."

Registration opens at 8 am and includes a complimentary lunch on the show floor. Exhibits are open from 9-3 pm and the first technical presentation will start at 9:30 am.

To register online to attend or exhibit, please click here.

Share


Suggested Items

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Configure to Order: Different by Design

01/09/2018 | Michael Ford, Aegis Software Corp.
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.



Copyright © 2018 I-Connect007. All rights reserved.