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IPC—The Association Connecting Electronics Industries will be holding a two-day, design-focused IPC professional development courses on July 26–27, 2017, in Chicago, Illinois.
Day 1 will focus on EMI control, including grounding, power distribution, and board stack-up, among others, and will be led by Rick Hartley. This workshop is all about up-front design. Getting the design right to prevent having to throw costly band-aids on the product to stop the hemorrhaging of electric and magnetic fields. The knowledge gained from this workshop can significantly reduce product development time and cost, as well as improve product performance.
The next day’s course will be on design challenges, including fine pitch BGA design, and best design practices to produce a more manufacturable board. To be given by Susy Webb, the first section of this two-in-one class utilizes illustrations and real-world examples to explore the complexities of using fine pitch BGAs in designs. The second section of this class discusses best practices that, when incorporated by the designer, will help make fabrication and assembly easier and therefore lower the time and cost needed for a quality board.
For more information, or to register for these courses, click here.
Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.
Patty Goldman, I-Connect007
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.