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IPC—The Association Connecting Electronics Industries will be holding a two-day, design-focused IPC professional development courses on July 26–27, 2017, in Chicago, Illinois.
Day 1 will focus on EMI control, including grounding, power distribution, and board stack-up, among others, and will be led by Rick Hartley. This workshop is all about up-front design. Getting the design right to prevent having to throw costly band-aids on the product to stop the hemorrhaging of electric and magnetic fields. The knowledge gained from this workshop can significantly reduce product development time and cost, as well as improve product performance.
The next day’s course will be on design challenges, including fine pitch BGA design, and best design practices to produce a more manufacturable board. To be given by Susy Webb, the first section of this two-in-one class utilizes illustrations and real-world examples to explore the complexities of using fine pitch BGAs in designs. The second section of this class discusses best practices that, when incorporated by the designer, will help make fabrication and assembly easier and therefore lower the time and cost needed for a quality board.
For more information, or to register for these courses, click here.