Recent Engineering Graduate Colin Poedtke Joins American Standard Circuits as Process Engineer


Reading time ( words)

American Standard Circuits CEO, Anaya Vardya has appointed engineering graduate Colin Poedtke to the position of process engineer specializing in all wet processes. Mr. Poedtke is new to the PCB industry, having recently received his degree in chemical engineering from the University of Illinois Urbana-Champagne.

Mr. Vardya commented, “We are pleased to have a recent graduate join the ASC family. As we all agree, this is an aging industry that desperately needs to recruit fresh talent from the younger generation in order to promote a healthy future. We look forward to working with Colin and taking advantage of both the new ideas and latest theories that he will contribute to our team.”

About American Standard Circuits

American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/Microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment.  Their qualifications include AS9100 Rev C, ISO 9001:2008, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. American Standard also holds a number of key patents for metal bonding processes. For more information about American Standard Circuits services or to ask one of their technology experts a question, click here.

To download American Standard Circuits new eBook, “The Printed Circuit Board Designer’s Guide to Flex and Rigid-Flex Fundamentals” visit their download site here.

Share


Suggested Items

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

02/14/2018 | Barry Matties, I-Connect007
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/12/2018 | Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

Aismalibar on Laminates, Following the Market, and More

02/06/2018 | Barry Matties and Patty Goldman, I-Connect007
At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.



Copyright © 2018 I-Connect007. All rights reserved.