Alpha's Latest Product Innovations Target Voiding Issues


Reading time ( words)

Voiding is a common issue in PCB assembly and is caused by volatile ingredients in the solder paste. It can occur anywhere in the solder joint and is especially problematic as it reduces the mechanical properties and thermal conductivity of solder joints.

To solve this issue, Alpha Assembly Solutions has developed the ALPHA AccuFlux Technology for preforms. The flux coating when applied to a preform is engineered to decrease voiding for power components that require consistent low-voiding solder joints from normal SMT processes.

"Alpha AccuFlux Technology allows a specially designed coating with an ultra-low voiding flux formulation to be applied accurately from preform to preform," explains Mike Marczi, vice president of engineered materials at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. "This precise flux deposit ensures a repeatable void performance. Preforms coated with AccuFlux also deliver excellent electrical reliability and maximized component heat dissipation."

In addition, Alpha TrueHeight Spacers are available for void reduction under LGA components. "TrueHeight Spacers can be strategically placed under LGA or any larger size leadless components to provide an exit path for outgassing," said Jerry Sidone, product manager for engineered materials at Alpha Assembly Solutions. "Their low profile and small size make them an ideal solution for void reduction and reducing component tilt."

To learn more about these void-reducing technologies, visit Alpha during SMTAI at Booth 1016.   

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.