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Indium Corporation's Brook Sandy-Smith, technical support engineer for PCB assembly materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017, to be held September 11–13 in Boston, Massachusetts.
Sandy-Smith will present "Overcoming Assembly Challenges with Bottom Termination Components (BTCs)." This presentation will review the updated recommendations for design and implementation of BTCs, including major changes made to IPC-7093. Sandy-Smith will also share strategies to minimize voiding and ensure robust BTC assemblies.
Sandy-Smith is a Technical Support Engineer specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.