Reading time ( words)
The European Institute for the PCB Community (EIPC) is extending the deadline for the submission of abstracts for paper presentation at the Winter Conference Lyon 2018, which will be held on February 1–2, 2018 in Alstom, France.
Abstract submission should be no later than September 10.
Click here for the detailed call for papers.
Click here for the abstract submission form.
Click here for the conference registration form
Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.
There can never be enough books about the art and virtue of listening. As a sales trainer, I've learned that there is nothing more challenging than teaching people how to be quiet and listen. So, it was with great anticipation that I read this new book by the Boltons. Never has there been a better time to try to teach people, not just salespeople to turn down the devices, focus, and start intentionally listening to one another.
Pete Starkey, I-Connect007
Part 2 of I-Connect007 Technical Editor Pete Starkey's article on the recent EIPC 50th Anniversary Conference in Dusseldorf, Germany, continues with recap of technical presentations by Emma Hudson, Shannon Juan, Alex Ippich, and Russell Morgan. Read on.