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RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow
September 13, 2017 | Real Time With... NEPCON South ChinaEstimated reading time: Less than a minute
Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Stephen Las Marias during the recent NEPCON South China event in Shenzhen about the need for a common communications platform or interface as the industry moves toward Industry 4.0. He talks about how their new ViCON software can help manufacturers achieve the smart factory vision.
Wagenfuehr also discusses how vacuum technology helps eliminate voiding in reflow soldering.
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Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
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Know-how Transfer at Rehm - Digital and In-Person
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