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Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Stephen Las Marias during the recent NEPCON South China event in Shenzhen about the need for a common communications platform or interface as the industry moves toward Industry 4.0. He talks about how their new ViCON software can help manufacturers achieve the smart factory vision.
Wagenfuehr also discusses how vacuum technology helps eliminate voiding in reflow soldering.
Watch the Interview Here
Bob Wettermann, BEST Inc.
There are two prevalent heating technologies in use throughout most electronic assembly operations for advanced component rework—the first method employs the use of hot air gas to heat up the component through the package, while the second much-used heating technology relies on infrared energy. This article highlights the pros and cons of the two methods, and discusses which one is the best to use for your application.
Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Stephen Las Marias, I-Connect007
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.