IPC Releases 2017 Quality Benchmark Study for Assembly


Reading time ( words)

IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods as well as the percentages of products subjected to these tests. Yields and defect rates at final inspection, internal yields of key processes, defect rates, and DPMO and yield targets, and the average cost of poor quality as percentages of sales for rework and scrap are also covered. The study also reports on the use of various quality control methods.

Customer satisfaction and supplier performance metrics are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, rigid backplanes, end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors.

The aggregate data represent 89 electronics assembly companies of all sizes – both OEMs and contract electronics manufacturers – in all regions of the world.

The 146-page report is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit www.ipc.org/AssemblyBenchmark2017 or contact IPC's market research department at marketresearch@ipc.org. For information on other IPC market research programs, click here.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share


Suggested Items

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

07/24/2018 | I-Connect007 Research Team
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.



Copyright © 2018 I-Connect007. All rights reserved.