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Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers avoid the void at productronica 2017, which will be held on November 14–17, in Munich, Germany.
The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:
- demonstrates consistent printing performance for up to 12 months when refrigerated;
- maintains excellent printing and reflow performance after remaining at room temperature for one month; and,
- delivers excellent response-to-pause even after being left on the stencil for 60 hours.
The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, click here or see Indium Corporation in Hall A4 at Booth 214.
Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.
Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.
Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.