Goepel electronic to Showcase Flexible Test and Inspection Solutions at productronica 2017


Reading time ( words)

At productronica 2017, Goepel electronic will be presenting its fully automated inspection solutions that are offering high fault detection, flexibility and cost reductions through time savings. Goepel electronic will be in Hall A1, Booth 235.

Being highlighted is the new StingRay X-ray detector, an additional option for the system family X Line·3D. With a highly flexible image acquisition concept consisting of high-speed axes and a flat-panel detector, selective 2D, 2.5D and 3D X-ray inspection of complex PCBs is possible. The new technology ensures even better layer separation and brighter images, especially in 3D images, but keeps the balance between image quality and inspection speed.

In the field of automated optical inspection (AOI), the system software PILOT AOI is being premiered with the new feature, MagicClick, which enables fully automated creation and optimization of AOI test programs, including component library, using a sample PCB. In only about three minutes, a production-ready test program can be generated. In comparison to the conventional approach, MagicClick offers significant cost savings and allows the use of AOI even for the smallest volumes. MagicClick is presented as part of VarioLine·3D, the AOI system for full 3D measurement of solder joints and components using an additional 360° angled-view.

PILOT Connect, the core of inspection solutions being offered in support of Industry 4.0, provides the most flexible MES connections. In combination with PILOT Supervisor, centralized verification of all inspection results from multiple inspection systems and types in the line becomes reality.

SCANFLEX II Cube is the new generation of JTAG/Boundary Scan controllers for board level embedded test. Based on state-of-the-art multi-core processors and FPGAs, the system sets new standards in the support of Embedded JTAG Solutions. The boards own circuitry is used for test and programming of complex boards with greatly reduced physical access requirements. With its multifunctional architecture, SCANFLEX II Cube supports numerous applications.

productronica 2017 will be held in Munich, Germany, from November 14-17, 2017.

Goepel_Fig1.jpg

Image 1: GOEPEL electronic booth at the productronica show

Goepel_Fig2.jpg 

Image 2: Inline X-ray inspection system X Line · 3D with StingRay Detector

Goepel_Fig3.jpg 

Image 3: AOI system VarioLine · 3D with MagicClick for automated test program creation

Goepel_Fig4.jpg 

Image 4: SCANFLEX II Cube JTAG/Boundary Scan Controller for Embedded JTAG Solutions

GOEPEL electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI·AXI·SPI·IVS

For more information click here.

Share


Suggested Items

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2017 I-Connect007. All rights reserved.