Goepel electronic to Showcase Flexible Test and Inspection Solutions at productronica 2017


Reading time ( words)

At productronica 2017, Goepel electronic will be presenting its fully automated inspection solutions that are offering high fault detection, flexibility and cost reductions through time savings. Goepel electronic will be in Hall A1, Booth 235.

Being highlighted is the new StingRay X-ray detector, an additional option for the system family X Line·3D. With a highly flexible image acquisition concept consisting of high-speed axes and a flat-panel detector, selective 2D, 2.5D and 3D X-ray inspection of complex PCBs is possible. The new technology ensures even better layer separation and brighter images, especially in 3D images, but keeps the balance between image quality and inspection speed.

In the field of automated optical inspection (AOI), the system software PILOT AOI is being premiered with the new feature, MagicClick, which enables fully automated creation and optimization of AOI test programs, including component library, using a sample PCB. In only about three minutes, a production-ready test program can be generated. In comparison to the conventional approach, MagicClick offers significant cost savings and allows the use of AOI even for the smallest volumes. MagicClick is presented as part of VarioLine·3D, the AOI system for full 3D measurement of solder joints and components using an additional 360° angled-view.

PILOT Connect, the core of inspection solutions being offered in support of Industry 4.0, provides the most flexible MES connections. In combination with PILOT Supervisor, centralized verification of all inspection results from multiple inspection systems and types in the line becomes reality.

SCANFLEX II Cube is the new generation of JTAG/Boundary Scan controllers for board level embedded test. Based on state-of-the-art multi-core processors and FPGAs, the system sets new standards in the support of Embedded JTAG Solutions. The boards own circuitry is used for test and programming of complex boards with greatly reduced physical access requirements. With its multifunctional architecture, SCANFLEX II Cube supports numerous applications.

productronica 2017 will be held in Munich, Germany, from November 14-17, 2017.

Goepel_Fig1.jpg

Image 1: GOEPEL electronic booth at the productronica show

Goepel_Fig2.jpg 

Image 2: Inline X-ray inspection system X Line · 3D with StingRay Detector

Goepel_Fig3.jpg 

Image 3: AOI system VarioLine · 3D with MagicClick for automated test program creation

Goepel_Fig4.jpg 

Image 4: SCANFLEX II Cube JTAG/Boundary Scan Controller for Embedded JTAG Solutions

GOEPEL electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI·AXI·SPI·IVS

For more information click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.