-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
PCB Signal Integrity Optimization Using X-ray Metrology
October 16, 2017 | Scott Jewler, SILICON VALLEY X-RAYEstimated reading time: 1 minute
Murphy’s Law
It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components. The integrated circuits were all speed tested prior to printed circuit board assembly. There must be a problem in the system assembly, but where?
For some time, control of printed circuit board manufacturing to specification has relied primarily on coupon tests. These are time-consuming and often poorly represent the live portion of a panel, much less a population of panels. Modifications to designs, variations in line and space widths, and misalignment of layers can occur without the supplier being aware of the impact these changes have on the system’s performance. Electrical test methodologies for bare boards are difficult to maintain, expensive, and provide limited information. Engineers are left to commit large amounts of money to board builds and cloud server manufacturing and hope the PCBs perform per design.
The challenge is getting harder
As the industry moves rapidly to full deployment of 28 Gbps backplanes, many cloud hardware and PCB manufacturers are just beginning to regain confidence that what they build will work as intended. But 56 Gbps backplanes are just around the corner, or already in the driveway for some companies. And line cards are not far behind. These faster data rates require even tighter design compliance and PCB process control.
Certainly, much of this battle will be fought on the design side. Single layer routing, sacrificial vias, and other techniques can mask PCB process variation. But is this the most desirable or cost-effective solution? The time is right for a new generation of metrology tools that will enable PCB manufacturers to build better products and for network designers to unleash the performance of their products without worrying about variances in as-built boards.
To read the full version of this article which appeared in the October 2017 issue of The PCB Magazine, click here.
Suggested Items
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
IPC WinterCom 2024 Through the Eyes of One Dedicated Student
04/12/2024 | Sanjay Huprikar, IPCLauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.