Nordson DAGE to Discuss Wafer X-ray Metrology at IWLPC


Reading time ( words)

Nordson DAGE, a division of Nordson Corporation, will exhibit at the 14th Annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place October 24-26, 2017 in San Jose, California. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.

The semiconductor market demands increasingly complex devices that are enabled by technologies such as TSV, PoP, 2.5D and 3D integration. These complex products demand a new level of metrology. Nordson DAGE, the leader in X-ray inspection for the electronics industry, presents the XM8000 X-ray metrology platform, for the fast, fully-automated, non-destructive measurement of, and within, metal features on up to 300 mm wafers.

The XM8000 system delivers fully automated, non-destructive, radiation safe defect detection for all complex devices, and is 30X faster than traditional X-ray. This new platform takes the market-leading capabilities from Nordson DAGE's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.

About Nordson DAGE

Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award-winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, click here.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web.

Share



Copyright © 2017 I-Connect007. All rights reserved.