Reading time ( words)
The November issue of The PCB Magazine has published and is now available.
HDI: Today, Tomorrow and the Future
This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manufacturing challenges, to HDI strategies that include design, fabrication, and assembly perspectives. As one of our feature contributors, Happy Holden, says, in North America, there is a growing need for more HDI capability. Find out why in this issue!
Check it all out this month in The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download pdf version to your devices for future reference.
Dan Feinberg, Technology Editor, I-Connect007
Now on its ninth year, the Augmented World Expo (AWE USA) is perhaps the largest event for professionals focused on providing science fiction-like abilities through XR (cross reality) and associated wearable technology. This year’s event showcased over 100,000 square feet of exhibit space and featured numerous presentations and discussions covering topics ranging from the latest and greatest uses and devices for XR to the business of marketing and monetizing it.
Mehul J. Davé, Entelechy Global, Inc.
While having on-demand capacity, improved automation, and fast turn-around are critical to any front-end engineering operation, achieving those goals with a cost-effective solution is imperative. Electronics are constantly under cost-reduction pressures. Functionality, capability, and complexity increase while costs decrease.
At DesignCon 2018, I spoke with James Hofer, general manager for Accurate Circuit Engineering, a quick-turn fabricator based in Santa Ana, California. James gave me a preview of AccuWrap, a new type of processing technology that lets designers reduce the amount of copper during sequential laminations while still meeting IPC specs, which should be of great interest to RF designers.