MacDermid's Metallization Fills Microvias, Plates Through-Holes in One Step


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MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, has released MacuSpec VF-TH 200 process, a high performance DC electrolytic copper metallization process for simultaneous via filling and through-hole plating. VF-TH 200 is a highly versatile process capable of replacing multiple steps in incumbent processes while improving the reliability and consistency of the deposit. With VF-TH 200, customers can fill 3x3 to 5x3 mil vias in less than 60 minutes with a dimple of less than 10 microns.

The MacuSpec VF-TH 200 process, in conjunction with MacDermid Enthone’s direct metallization solutions, Shadow, Blackhole, and ENVISION HDI, allows our customers to achieve optimized process performance. Cost savings are realized through waste reduction, decreased copper thickness, and cycle time. The highly evolved process also eliminates the need for pre-dip and flash plating process steps, furthering cost reduction. This unique combination of efficiency, reliability and cost reduction can only be found from the leader in innovation and technology, MacDermid Enthone.

Bill Bowerman, Director of Metallization, MacDermid Enthone, noted, “The VF-TH 200 bath is one of the most versatile and innovative pattern plate copper metallization solutions available to the manufacturers of MSAP / SL-HDI type boards today. On a broader scale, we anticipate VF-TH 200 to become the most widely used copper via filling process in its market segment.“

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. To learn more about the MacuSpec VF TH 200 click here.

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