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The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show), to be held from December 6–8, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will feature leading industry experts sharing their insights on the latest market trends and innovations.
Topics to be discussed include advancing HDI technology, mobile intelligent telecommunications, PCB production for the automotive industry, smart manufacturing for PCB production, cleaning PCB / PCBA flux residual process, and conformal coating trends, among others.
Click here to view the full agenda.
03/21/2018 | Dan Beaulieu
ACT-USA is one of the best value-added PCB distributors in the country today. Focused on providing their North American customers with boards as well as heavy copper boards they have steadily broadened their vendor base since their inception in 1994.
02/14/2018 | Barry Matties, I-Connect007
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
02/12/2018 | Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!