Rehm Presents Innovations at IPC APEX EXPO 2018


Reading time ( words)

IPC APEX EXPO invites specialist visitors to San Diego, California from 27 February to 1 March 2018 under this banner. Rehm Thermal Systems is once again present at this major electronics trade fair this year and presents its latest plant technology for reliable reflow convection and condensation soldering at booth 1500.

Rehm presents the following new thermal system solutions to visitors at IPC APEX EXPO:

VisionXP+: Reflow convection soldering

The VisionXP+ convection soldering system combines many further developments, in particular with regard to optimising energy efficiency and reducing emissions. Customers can save up to 20 % energy in electronics manufacturing with this system, consuming an average of 10 tonnes less CO2 per year. The VXP+ is also available with an vacuum option makes condensation soldering processes possible with or without vacuum for the first time – all in one system!

ViCon.JPGViCON: Simple system operation and optimum process traceability

Rehm presents the new ViCON software in the area of smart data and networking, featuring a touch-screen user interface. The German machine manufacturer has developed an innovative solution for easy operability and optimal traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

Condenso.JPGCondensoXC: top performance for best reflow condensation soldering

Reflow condensation soldering with the CondensoX series carries out the soldering process by means of hot steam and the Galden medium. Large, heavy boards can be processed without a problem since the heat transfer is up to ten times higher than with convection soldering. The use of the injection principle and the control of temperature and pressure ensure accurate and diverse reflow profiling. Rehm presents the new CondensoXC at the trade fair. The plant is a particularly space-efficient, high-performance system in the CondensoX series and ideal for laboratory applications, small batch production or prototyping. Void-free soldering can be easily implemented in all systems of the series with the vacuum option.

About Rehm Thermal System

As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.

For more information, click here.

Share


Suggested Items

Best Practices to Achieve Zero Defects

08/14/2018 | Stephanie Weaver, Zentech Manufacturing Inc.
To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.

IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

08/01/2018 | Patty Goldman, I-Connect007
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.