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I-Connect007 is proud to continue expanding its micro eBook design series: The Printed Circuit Designer’s Guide to… This ongoing series of eBooks is specifically dedicated to educating PCB designers and enhancing their knowledge. It serves as a valuable resource for people seeking the most relevant design information available.
Each eBook is peer reviewed by industry experts to ensure technical accuracy. Published titles cover a variety of such topics as signal and power integrity, high-speed PCBs, RF/microwave PCBs, flex and rigid-flex PCBs, and design for manufacturing (DFM). Upcoming releases include thermal management with insulated metal substrates, designing complex PCBs, and documentation.
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Andy Shaughnessy, Design007 Magazine
For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.
I-Connect007 Editorial Team
Not too long ago, historically speaking, most electronic products contained only one PCB. But multi-board designs have become almost ubiquitous over the past decade, and EDA software companies are working to improve and simplify the multi-board design process. Editors Andy Shaughnessy and Stephen Las Marias spoke with Ben Jordan, director of product and persona marketing for Altium, about the company’s multi-board design tools, the challenges that customers face, and the numerous trade-offs that designers must contend with while performing multi-board design.
Bob Potock, Zuken
A new generation of 3D multiboard product-level design tools offer major improvements by managing multiboard placement in both 2D and 3D, and enabling co-design of the chip, package and board in a single environment. Multiboard design makes it possible to create and validate a design with any combination of system-on-chips (SOCs), packages, and PCBs as a complete system.