Best Technical Paper at IPC APEX EXPO 2018 Selected


Reading time ( words)

The best technical conference paper of IPC APEX EXPO 2018 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 27.

Taking top honors, the winning paper is, “Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils” by Marina Y. Koledintseva, Oracle. Her co-author was: Tracey Vincent, CST of America. This paper will be presented during Technical Conference Session 16 (PCB Signal Integrity/High Speed/High Frequency) on Wednesday, February 28.

This year, two papers were selected in the honorable mention category. Honorable mention went to, “Derivation of Equation on Thermal Life Prediction of Plated Through-Hole for Printed Wiring Board” by Yoshiyuki Hiroshima, Fujitsu Advanced Technologies Limited. His co-authors were: Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya and Kazuki Watanabe, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Company, Ltd.; and Jack Tan, HDP User Group International, Inc. This paper will be presented during Technical Conference Session 12 (PCB Reliability) on Wednesday, February 28.

Honorable mention also goes to “Bottom Heating during Manual Rework” by Lars Bruno, Ericsson AB. This paper will be presented during Technical Conference Session 20 (Rework) on Wednesday, February 28.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, click here.  

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share

Print


Suggested Items

Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics

01/15/2019 | Patty Goldman, I-Connect007
Senior-level executives from across the global electronics supply chain will gather to discuss opportunities and challenges facing the rapidly changing automotive electronics industry. With five expert speakers and a powerful keynote from GreenSource VP Alex Stepinski, registration will fill fast.

A Look at Medical Electronics Design and Assembly Challenges

12/26/2018 | I-Connect007 Editorial Team
We recently spoke with Dr. Despina Moschou, lecturer at the University of Bath, as well as Kaspars Fricbergs, VP of global quality, and Tom Reilly, director of marketing and sales operations, of EMS firm Vexos Corp., to learn more about the challenges and opportunities in medical electronics design and assembly, as well as the relevant regulatory and supply chain issues.

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

12/18/2018 | Dennis Fritz, Fritz Consulting
In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.



Copyright © 2019 I-Connect007. All rights reserved.