Linda Woody, Stephen Tisdale Earn Dieter Bergman IPC Fellowship Awards


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In recognition of their ongoing leadership in developing and promoting IPC standards on a global basis, IPC has bestowed Dieter Bergman IPC Fellowship Awards upon Linda Woody, LWC Consulting, and Stephen Tisdale, Tisdale Environmental Consulting LLC at IPC APEX EXPO 2018.                

This recognition is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry and embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. Award recipients are eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice. Woody’s selection was University of Central Florida in Orlando and Tisdale selected the Thomas J. Watson School of Engineering at Binghamton University in New York.                           

Linda Woody has supported IPC’s standardization efforts for more than 20 years and made her first technical presentation in 1997 on behalf of IPC. Since then, she has served on more than 40 IPC committees, chaired the 2-18d Printed Board Declaration Task Group and the Lead-free Electronics Risk Management consortia known as PERM and has been working on lead-free issues since the mid ‘90s. Woody has not only had a direct hand in drafting IPC documents, but has also participated in numerous round robin testing programs to collect data to support the requirements within the documents.       

Woody recently retired from Lockheed Martin after 36 years, serving as a member of the Lockheed Martin Production Technical Excellence staff, where she was a corporate subject-matter expert for electronics assembly and soldering processes. She now serves a president and CEO of her own consulting business.                         

Stephen Tisdale, has been involved in the electronics industry for more than 40 years and with IPC standards development activities and initiatives for most of his career. He is a recognized content expert in the areas of environmental compliance, semiconductor packaging, PCB design, materials and assembly.                                 

While at Intel, Tisdale directed RoHS compliance implementation strategy, and technology compliance evaluations and set internal direction for halogen free strategies, and received a company excellence award for contributions to its lead-free program.              

Tisdale currently lends his talent and expertise on technical compliance issues on 30 IPC committees and serves as chair of the 4-34B Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group. He has also presented at past IPC APEX EXPO events and is a published author on several technical topics.

"IPC and the entire electronics industry are fortunate to have both Linda and Stephen volunteer their time and expertise to IPC standards and program development," said John Mitchell, IPC president and CEO. "Their work has enriched both the industry and IPC and we are thankful for their dedication."                                                                           

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300-member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.

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