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Richard DePoto of Uyemura discusses a unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.
To watch the interview, click here.
Stig Källman, ERICSSON with Happy Holden, I-CONNECT007
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.
Saminda Dharmarathna, et al.
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors.
Andy Behr, Panasonic Electronic Materials
Emerging end-use electronic applications are driving dramatic innovations in circuit board and interconnection technology. New form factors, functionality and durability requirements are challenging the status quo for the PCB industry and pushing design, material and process development to the limit.