AT&S (China) Earns High and New Tech Enterprise Certificate


Reading time ( words)

AT&S Austria Technologie & Systemtechnik AG is pleased to announce that it‘s subsidiary AT&S (China) Company Limited once again has been rated as High and New Tech Enterprise (HNTE). The certificate is jointly issued by Shanghai Taxation Bureau, Shanghai Finance Bureau as well as Shanghai Science and Technology Commission. 

It recognizes companies that satisfy regulatory requirements, among others, on high-level scientific research, high and new technology income and science and technology personnel. The certificate was received for the calendar years 2017 through 2019. In the course of preparing the annual report for 2017/18 AT&S is therefore able to apply retrospectively a reduced corporate income tax rate of 15% (versus the statutory 25%) for AT&S (China) Company Limited.

Share

Print


Suggested Items

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).

Electrolytic Plating: Filling Vias and Through-holes

05/28/2019 | M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.

Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination

05/13/2019 | Joan Tourné, NextGIn Technology BV
Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.



Copyright © 2019 I-Connect007. All rights reserved.