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Hitachi Chemical Co., Ltd. has decided to construct a new factory to manufacture advanced functional laminate materials for printed wiring boards (pre-preg and copper-clad laminates) on the site of Hitachi Chemical Electronic Materials (Taiwan) Co., Ltd. (HCET), Hitachi Chemical's subsidiary in Taiwan. Hitachi Chemical will invest a total of approximately 7.5 billion yen and the new factory will begin operation by April 2020.
Hitachi Chemical's laminate materials for printed wiring boards are being well received in the market, especially with demand for its advanced functional laminate materials for semiconductor packaging substrates used in various fields, including 5th generation wireless systems (5G), advanced driver-assistance systems (ADAS) and artificial intelligence (AI), expected to grow stronger in the medium- to long-term. To address its customer needs promptly under these circumstances, Hitachi Chemical has decided to invest in establishing a supply system in Taiwan, the biggest demand center for advanced functional laminate materials.
Hitachi Chemical will take advantage of this new factory to boost the sales of its advanced functional laminate materials by developing a production system capable of delivering timely supplies to its customers.