Goepel electronic Improves Inspection of Solder Pastes, DCB Substrates


Reading time ( words)

Goepel electronic has upgraded the inline inspection system SPI Line · 3D. In addition to 3D solder paste inspection, the SPI Line · 3D now has new features for testing sinter pastes and direct copper bonded (DCB) substrates.

Due to the high precision of the system in conjunction with the new functions, process errors in sinter paste printing can now also be detected. Even the smallest defect structures such as voids and particles with heights below 20 µm can be detected with reproducible results. In addition, the system is now able to inspect DCB substrates. For example, air pockets (voids) on DCB structures can be reliably measured from a height of 10 µm. This makes the SPI Line · 3D the only SPI system currently available on the market that can be used for both traditional solder paste inspection with typical solder paste heights of 80 µm to 150 µm and for the newer applications of sinter paste and DCB testing with significantly lower structural heights.

The system software PILOT SPI provides the user with simple and intuitive test program creation. The operation is possible via touchscreen. Complete test programs can be created in less than 10 minutes.

The PILOT Connect software module connects the system with other inspection systems. This common interface for SPI, AOI and AXI centrally captures and manages all inspection data as well as the machine and operating data of the connected systems. It also allows bidirectional communication to higher level MES and traceability systems.

Furthermore, all inspection information can be merged on a central verification and repair station, combining data to create the safest and most dependable fault assessment environment available along with completely new possibilities for optimizing the production process.

Share


Suggested Items

Electronic Components Market Update

10/04/2018 | Daniella Baldock, JJS Manufacturing
Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.

DFM: Top Ten PCB Concerns

07/09/2018 | Dan Thau, Millennium Circuits Ltd
DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.



Copyright © 2018 I-Connect007. All rights reserved.