Reading time ( words)
With all the elements that can now affect the solder mask—finer featres, higher temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention.
In this July 2018 edition of PCB007 Magazine, our contributors explain how and why solder mask must do its job well—precisely, in fact.
Check it all out this month in PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the pdf copy for future reference.
Patty Goldman, I-Connect007
MIVA Technologies is a leading equipment builder for direct imaging technologies in the circuit board and microelectronics space. The company’s head of its business development group, Brendan Hogan, sat down for an interview to provide some background and where the company’s specialties lie.
Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.
Pete Starkey, I-Connect007
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.