AIM to Feature REL61 at the SMTA Ohio Expo & Tech Forum


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AIM Solder will highlight its novel REL electronic solders, REL22 and REL61, at the SMTA Ohio Expo & Tech Forum, scheduled to take place on July 12, 2018 at Embassy Suites Cleveland Rockside in Independence, Ohio.

AIM’s new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage, and reduce costs and waste. AIM's REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.

Along with their REL alloys, AIM will showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To discover all of AIM's products and services, visit the company at the SMTA Ohio Expo & Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.

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August 23, 2018 - SMTA Capital - Kossiakoff Center, Laurel, Maryland

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