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High-density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Designers wanting to learn more are invited to attend IPC’s technical education course, “Designing Boards with HDI Technology” on November 6 in Raleigh, N.C. The course will be held in conjunction with PCB Carolina.
Instructor and senior PCB designer with Design Science, Suzy Webb, will provide instruction on HDI technology and cover: the structure of the HDI traces and vias; options and effects of cost and electronics; options for stack up types; how to get signals and powers from layer to layer in the board; patterns and grids such as via in pad, offset or swing vias to maximize fanout and routing opportunities; and routing return, power distribution, and layer paired routing. In addition, Webb will lead a discussion on the benefits HDI technology provides to other parts on the board, along with the unique manufacturing needs of these types of boards.
IPC’s technical education course registration includes access to PCB Carolina including exhibition, keynote address, and morning and afternoon technical sessions on November 7. Attendees who want to learn more about IPC and its services are invited to join IPC staff for a free networking event, IPC Day, the evening of November 6, immediately following IPC’s course.
For more information or to register for “Designing Boards with HDI Technology,” click here.