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Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products, from consumer to industrial, from computing to IoT, from medical to military applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intermetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
Dr. Jennie S. Hwang leverages her decades of comprehensive real-world experiences and deep knowledge to address solder joint reliability and the role of intermetallic compounds by integrating scientific fundamentals with practical requirements at the upcoming SMTA International 2018 event.
On October 15, Dr. Hwang will discuss relevant aspects of solder joint reliability at her PDC 13, Solder Joint Reliability – Principles and Applications, and PDC 19, Reliability of Electronics – The Role of Intermetallic Compounds. Attendees are encouraged to bring their own selected systems for deliberation.
For more information, contact Tanya Martin at firstname.lastname@example.org. To register, click here.
Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.
David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.
I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.