Managing the Challenges of Flex and Rigid-Flex Design
September 12, 2018 | Dave Wiens, Mentor, a Siemens BusinessEstimated reading time: 1 minute
PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.
Rigid-flex technology is usually applied when a product needs to be compact, lightweight and/or flexible. Examples of end products where flex and rigid-flex systems are found include smart phones, modern televisions, digital cameras and laptops. As flex and rigid-flex boards are becoming more complex, modern design tools must be able to understand the unique design constructs and rules that surround these designs.
The Key Benefits of Flex and Rigid-Flex
The major benefits of flex and rigid-flex technology implementation and why design teams need to adopt this methodology include:
- Reduced cost and increased reliability by eliminating physical connectors used in the traditional “design-separately-then-assemble” approach to systems design.
- Improved signal integrity through the removal of cross-sectional changes to the conductors (eliminating physical connectors and their associated solder connections).
- Physical space requirement reduction since parts can be placed, and traces can be routed, in three dimensions.
- Improved electromechanical functionality including dynamic bending, vibration and shock tolerance, heat resistance, and weight reduction.
To read this entire article, which appeared in the recent issue of Flex007 Magazine, click here.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.