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T-Global Technology Offers Solutions for Thermal Management Challenges

04/10/2024 | I-Connect007 Editorial Team
James Hopkins from T-Global discusses the company's focus on thermal management products, including thermal interface materials, heat sinks, and thermal simulation services. He highlights the importance of collaborating with mechanical engineers and addressing challenges in balancing thermal performance and mechanical requirements. Hopkins also mentions the role of thermal simulation in guiding product recommendations and the significance of early collaboration among stakeholders for optimal product outcomes.

RiverSide Integrated Solutions, Inc. Celebrating 40 years of Innovation and Excellence

03/21/2024 | RiverSide Integrated Solutions, Inc.
RiverSide Integrated Solutions, Inc., a pioneer in electronic and electromechanical assembly, proudly celebrates the 40th anniversary of the RiverSide name this March.

Uyemura Boosts Field and Met Lab Teams

02/21/2024 | Uyemura
Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.

EMA Design Automation and Hawk Ridge Systems Reshape Landscape with Full ECAD/MCAD Convergence

02/07/2024 | EMA Design Automation
EMA Design Automation and Hawk Ridge Systems entered a strategic partnership to give customers a full ECAD/MCAD design experience, leveraging best-in-class tools and support for the entire electronic product design flow. 

Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud

11/20/2023 | ANSYS
Ansys has collaborated with TSMC and Microsoft  to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.
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